Tessera.com provides micro-electronics, imaging & optics worldwide
Title
Tessera Technologies
Description
When Tessera, Inc. was founded in 1990, we took our name from the Latin word for "tile", evoking an image of packaged chips being tiled closely together as in a mosaic. As demand for high performance, small size and better reliability in electronic devices was growing at an unprecedented rate, semiconductor companies found that silicon packaging - the physical interface between the silicon die and the circuit board - was a bottleneck that had to be overcome.
To meet the need for small, fast and reliable packaging, and to make possible many of the electronic advances witnessed in the 1990s, Tessera developed packaging solutions that were virtually the same size and speed as the silicon chip itself. This technology became known as "Chip Scale Packaging" or "CSP", and the technology has become broadly adopted. In fact, one million packages using Tessera's µBGA® CSP technology are produced each day for products ranging from cellular phones to network servers.
Today we continue our work by providing a broad range of advanced packaging solutions - from stacked chip solutions to wafer-level packaging - and a full suite of customer services that enable electronics companies to meet their growing and changing packaging needs.
Contact
- Tessera, Inc.
-
- San Jose CA
- US 95134
-
- 3099
Logos
Additional Information
Related Domains
- 3 D Package
- 3 D Packaging
- Advanced Packaging
- Bga
- Ball Grid Array
- Ball Stack
- Csp
- Chip Scale
- Chip Scale Package
- Chip Scale Technology
- Compliant Chip
- Compliant Layer
- Ddr Ii
- Die Stack
- Die Stacking
- Fbga
- Fine Pitch Bga
- Fold Over
- Integrated Passives
- Land Grid Array
- Mbga
- Mcp
- Memory Modules
- Micro Z Miniaturization
- Micro Bga
- Multi Chip
- Multi Chip Package
- Package Design
- Package Solutions
- Package Stacking
- Packaging
- Power Amplifier Module
- Pyxis
- Rf Module
- Sip
- Semiconductor Packaging
- Stacked
- Stacking
- System In Package
- System Integration
- System Level Integration
- System Miniaturization
- Tessera
- Tessera Technologies
- Thermal Solutions
- Ubga
- Wlp
- Wafer Level
- Wave
- 3D Package
- 3D Packaging
- BGA
- CSP
- DDR II
- FBGA
- Fine Pitch BGA
- Fold-over
- MBGA
- MCP
- MicroZ Miniaturization
- Micro BGA
- Multi-chip
- Multi-chip Package
- RF Module
- SIP
- UBGA
- WLP