PacTech.com
About PacTech.com
Pac Tech is a world leading provider of advanced wafer bumping, packaging and solder-ball placement equipment. As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, Pac Tech also provides state-of-the-art worldwide contract services for low-cost wafer level bumping and packaging at competitive prices and the highest quality.
