Cmptechnology.com
Title
CMP Technology - Simulation, pattern density calculation and dummy filling for better planarization and yield for aluminum, copper, ILD and STI CMP process using HDP or CVD film. Joint optimization with OPC, PSM and interconnect parasitic extraction.
Description
Our Mission
To provide the best, silicon validated yield enhancement solutions for semiconductor CMP process through full-chip simulation, density calculation and dummy filling.
Company Profile
CMP Technology develop and markets software solutions in CMP simulation and dummy filling. It's software package CLIP is the first commercial CMP software package, and it's also the first to have been validated in real life production.
The company was founded by Dr. Kai Yang and Dr. George Liu. Together, they have over 20 years of industrial experience in engineering, engineering management and high-tech venture management. The have expertise not only in semiconductor processing such as photo-lithography, chemical mechanical polishing, but also in phase-shift mask design, interconnect parasitic extraction, layout verification, electromagnetic waves and digital signal processing.
Languages
English
