Sela.com is a company offering engineering in semiconductor industry
Title
Automated manufacturing equipment for the semiconductor and optical components industries
Description
SELA, founded in 1992, produces automated sample preparation systems used primarily by semiconductor manufacturers to prepare samples for scanning electron microscopy (SEM), transmission electron microscopy (TEM) and atomic force microscopy (AFM). The information provided by these tools is critical in developing new manufacturing processes, controlling and diagnosing problems in existing processes. The bottleneck in the feedback loop is often in the elaborate procedures required for sample preparation. With manufacturing facilities capable of producing millions of dollars worth of product per hour, every minute counts. SELA's automated systems can reduce sample preparation time from days to hours and from hours to minutes.
The economic benefits of automating sample preparation are immediately apparent to SELA customers. Over 210 SELA systems are currently in use worldwide. Many major semiconductor manufacturers, including Motorola, Texas Instruments, National , IBM, Samsung, Sony, Renesas, TSMC, UMC and ST Microelectronics use SELA systems to dramatically reduce defect analysis turnaround times in their research and development, process development, failure analysis, and manufacturing quality control analytical labs. More than 50 percent of SELA MC Series systems users have ordered additional systems. The SELA TEMpro TEM sample preparation system and the SELA MC200 Microcleaving system have been selected by Semiconductor International to receive its prestigious Editors' Choice Best Product Award.
Semiconductor devices contain submicron-scale components built up layer by layer on a silicon wafer. Defects occur in the manufacturing process when one of the structures is not well formed or when contaminants are inadvertently incorporated into a device. Detecting defects and diagnosing their root causes are important aspects of controlling the manufacturing process. In order to look at defects and structures below the surface of a device, analysts break the silicon wafer to create a cross section. Silicon, like diamond, can be precisely cleaved along crystal planes.
Languages
English
Contact
Administrative:
-
- Santa Clara CA
- United States 95051
-
- (408) 261-0172
Registrant:
- SELA USA
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- Sunnyvale CA
- United States 94086
Logos
Additional Information
Related Domains
External Links
- Alexa: Sela.com
- Business
- Cleaving
- Components
- Electronics And Electrical
- Fib
- Failure Analysis
- Fb Laser
- Fiber
- Fiber Optics
- Focused Ion Beam
- Ga As
- Laser
- Laser Manufacturing
- Metrology
- Microcleaving
- Optic Fiber
- Optical
- Optical Components
- Process Monitoring
- Sela
- Sem
- Sample Cross Section
- Sample Preparation
- Scanning Electron Microscopy
- Semi
- Semiconductor
- Semiconductors
- Specimen Preparation
- Tem
- Tools And Equipment
- Transition Electron
- Transition Electron Microscopy
- Electronics and Electrical
- FIB
- GaAs
- SELA
- SEM
- Sample Cross-section
- TEM
- Tools and Equipment