NewCompSystems.com
Title
Home Page: Newcomp Systems, Inc.; Complex printed circuit board (PCB/PWB) rigid/flex, SMT, BGA, Chip on board assemby, design and test manufacturing and assemby; finished box assembly
Description
Contract and turn key manufacture of BGA, Ball Grid Array, SMT, Chip on Board, through hole assembly, test; experts in teflon, polyimide, G-10, FR-4 CEM Type I, II, III and Ceramic substrates
Additional Information
Categories:
- 4 Cem Type I
- Assembly
- Bga
- Ball Grid Array
- Cecom
- California
- Chip On Board
- Communications
- Experts In Teflon
- Fr
- Facsimile
- Flex Circuit Fabrication
- Gps
- Global Positioning System
- Globalstar
- Group 3
- Hpa
- Hand Held Beacon
- Ii
- Iii And Ceramic Substrates
- Iso
- Iso 9000 Compliant
- Inmarsat
- Ldf
- Mri
- Magnetic Resonance Imaging
- Mini M
- Multilayer To 22 Layers
- Polyimide
- Printed Circuit Board
- Sar
- Smt
- Satcom
- Search And Rescue Satellite
- Stanton
- Surface Mount Technology
- Through Hole
- Uxc
- United States
- Video Conferencing
- Wideband
- 10
- 4 CEM Type I
- 7
- 9001
- AN
- BGA
- CECOM
- FR
- G
- GPS
- HPA
- II
- III And Ceramic Substrates
- ISO
- ISO 9000 Compliant
- LDF
- Localities
- MRI
- Mini-M
- North America
- Regional
- SAR
- SMT
- Test
- UXC