L.M. Bejtlich & Associates, LLC. LCD Repair,Thermal bonding, ACF bonding, Film Lamination, Chip on Board, COB, Chip on Film, COF, Chip on Glass, COG

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ACF Bonding Technology including the design and build of equipment for trace alignment tacking and thermal compression bonding of components Engineering services include processes for the repair and replacement of components Joining miniature electrical circuits ACF bonds Joining flex conductor to glass ICs PCBs Flat...

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