Interconnect Systems, Inc. – 3D Packaging, Advanced Packaging, IC Adapter, Obsolete IC, IC Interposer, BGA Reballing, Custom Interconnect, Standard Interconnect, etc.
Description
pulled from site's meta descriptionISI – Leading provider for 3D packaging, advanced packaging, bare die or multi-die packaging, high density modules, IC Adapter, IC Replacement, BGA reballing, custom Interconnect, standard Interconnect, etc.
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Categories:
- AboutUs AutoGen
- 3D packaging
- advanced packaging
- IC packaging
- bga reballing
- reballing
- multi die packaging
- bare die packaging
- IC adapter
- IC sockets
- 3D IC
- obsolete IC
- IC replacement
- standard connector
- custom connector
- obsolete FPGA
- miniature FPGA
- stacked die
- multi-chip module
- package in package
- package on package
- high density memory
- hybrid assembly
- chip on board
- flip chip
- IC obsolescence
- FPGA replacement
- EOL FPGA
- interconnect
- flex circuit
- interposer
- die assembly
- flexframe
- bga reball