Broadpak.com develops material for part packaging and semiconductive items
Title
signal integrity, high speed, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, advanced packaging, package design, ball grid array, ball stack, BGA, chip scale, chip scale package, CSP, DDR II, die stack, die stacking, FBGA, fine pitch BGA, land grid array, MBGA, MCP, memory modules, memory stacking, multi chip, multi chip package, package design, package solutions, package stacking, packaging, RF module, semiconductor packaging, system in a package, SIP, stacked, stacking, system in package, system integration, system level integration, system miniaturization, broadpak, thermal management, thermal modeling, 3D wafer level packaging, WLP
Description
Excerpted from the website:
- BroadPak is a premier provider of semiconductor package substrate design and test services. Over the years BroadPak has designed and delivered some of the most advanced high performance substrates in the industry for many of the leading companies.
Additional Information
Related Domains
External Links
- 3D Package
- 3D Packaging
- 3D Wafer Level Packaging
- Advanced Packaging
- BGA
- Ball Grid Array
- Ball Stack
- Broadpak
- CO Design
- CSP
- Cavity Down
- Chip Scale
- Chip Scale Package
- DDR II
- Die Stack
- Die Stacking
- FBGA
- Fine Pitch BGA
- Flip Chip
- High Speed
- IR Drop
- Land Grid Array
- MBGA
- MCP
- Memory Modules
- Memory Stacking
- Multi Chip
- Multi Chip Package
- Package Design
- Package Solutions
- Package Stacking
- Packaging
- Power Integrity
- RF Module
- Reliability Modeling
- SIP
- Semiconductor Packaging
- Signal Integrity
- Stacked
- Stacking
- Substrate Design
- System In A Package
- System In Package
- System Integration
- System Level Integration
- System Miniaturization
- Thermal Management
- Thermal Modeling
- WLP