Die Bonder, Flip Chip Bonder, Wafer Ink Systems and more - AMICRA microtechnologies
Description
pulled from site's meta descriptionAMICRA Microtechnologies' high precision die bonder / flip chip bonders, wafer ink systems and dispense & test systems can optimize your bond process and reduce costs in back-end packaging. Visit our product specific pages to learn more about the customized services we can offer to your company.
This is an automatically generated AboutUs page for Amicra.com. Click the "Edit" button at the top of the page to make changes. Please read our Getting Started page if you need any help.
Domain Resolution
This domain resolves to the following IP addresses:
Categories:
- AboutUs AutoGen
- high precision die bonder
- die bonder
- flip chip bonder
- wafer inking system
- microelectronics
- die bonding
- flip chip bonding
- flip-chip
- silicon gel dispense line system
- dispensing systems
- test systems
- micro assembly
- eutectic laser soldering
- epoxy bonding
- LED
- MEMS
- µ bonder
- die attach
- active optical cable
- tsv
- tcb
- semiconductor backend